Applications for Compact Cooling Systems
Aspen’s cooling systems are used across a range of applications, including the areas listed below. Aspen’s ability to design an optimized solution for our customer’s thermal management challenges has helped our customers succeed time and time again. Our ability to work with the customer on a cooling system which is compact, efficient, and reliable provide our customers with a distinct market edge over their competition. Some customers use our line of standard products (ECUs and LCMs – see Products), while most OEM customers tap into Aspen’s refrigeration expertise and customize a solution to their unique needs (see Custom Solutions). Click on the links below to see examples of how Aspen Systems has helped our customers succeed. Contact Us to learn how Aspen can benefit you in your application.
Medical device designers and manufacturers must keep the equipment size, noise, and power consumption minimized while incorporating thermal management systems. Aspen Systems has been developing and manufacturing cooling systems for medical devices for many years that are compact for direct integration into the medical device console yet provide powerful levels of cooling while operating at high efficiency to reduce heat rejection in the operating room, clinic, or doctor’s office.
Applications such as blood analysis and DNA decoding require compact, accurate, and reliable cooling systems to meet the demands of laboratory instruments. The Aspen Systems product development team has worked closely with multiple customers to develop vapor compression cooling systems that are efficient, accurate, quiet, and reliable to meet the demands of laboratory and life science applications while being compact for easy integration within our customer’s devices.
Laser product managers are seeing similar pressure to reduce the size of the external laser chiller while still offering improved cooling and energy efficiency. Some are considering adding the refrigeration system directly into their laser system to form an integrated compact package. It is important to make decisions early in the concept development of the product development cycle to ease the integration of advanced cooling methods such as direct refrigerant cooling.
It is no secret that electronics packaging and semiconductors have gotten smaller, while their heat dissipation has gotten greater over the last decade. Aspen’s product development team is using advanced techniques to meet the requirements of both testing and IC cooling.
Military vehicles are designed to operate in extreme conditions including a large range of ambient temperatures, as well as shock, vibration, blowing sand, and driving rain, to name a few. This leads to the requirement for thermal management systems that can not only handle the heating and cooling needs of the electronics but must also be designed to survive the aforementioned environmental challenges. Aspen has a long track record of successfully developing and manufacturing thermal management systems for a range of military applications.
The growth of Electric Vehicles (EV) ushers in a need for novel thermal management solutions. Heat loads driven by ever-increasing and higher energy densities in battery technology, electronics, and rapid charging require high-efficiency cooling systems in compact packages.