It is no secret that electronics packaging and semiconductors have gotten smaller, while their heat dissipation has gotten greater over the last decade. With heat fluxes at the integrated circuit (IC) level rising, enhanced cooling techniques such as liquid or direct refrigerant approaches are being utilized to meet the challenge of maintaining allowable junction temperatures. For example, power hungry IC’s in smart data centers require advanced cooling to maintain high performance. For automotive applications, IC’s are being tested at a much wider range of temperatures to assure performance in outdoor applications such as automobiles and to assess performance as a function of temperature. Aspen’s product development team is using advanced techniques to meet the requirements of both testing and IC cooling. These cooling systems are being utilized by our electronics industry customers to gain an edge with their offerings.
- Artificial Intelligence is now being applied to address food waste and food safety.
- A monitoring and control system installed at grain storage bins monitors both the weather and the conditions in the bins in real time and determines when to activate aeration systems to prevent mold and insect activity in the grain.
- Aspen was tasked with developing a custom thermal management system for cooling of the monitoring electronics and microprocessor for field deployed systems.
- Integrated Circuits are tested over a large temperature range to determine clock speed.
- Thermal Forcing Systems are used in development and production to achieve the operating temperature range.
- Aspen developed and manufactures several novel direct expansion vapor compression cooling systems that meet the range of requirements for this application.